Senior Design Automation Engineer

Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.<br/><br/>We are seeking a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next-generation machine learning and data center ASICs.<br/><br/>In this role, you will develop automation to enable physical design teams to execute Package and PCB products from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets..<br/><br/><br/><br/>Key job responsibilities<br/>• Develop and deploy efficient design methodologies to support Package and PCB layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.<br/>• Evaluate industry EDA offerings and make recommendations for purchase and usage of advanced packaging features to design 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).<br/>• Deliver custo