Optical Networking Architect / High-Speed Interconnect Chip Technology Lead

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Descrizione

Position Title Optical Networking Architect / High-Speed Interconnect Chip Technology Lead Role Overview Own the end-to-end technology leadership of data-center optical interconnect — optical modules, ODSP, and high-speed electrical chips — spanning product definition, system architecture design, algorithm development, opto-electronic co-design, and volume-production delivery. The role requires deep expertise across optical systems, high-speed mixed-signal chips, and algorithms, plus proven ability to lead cross-regional, cross-team joint development. Key Responsibilities Technology & Product Definition : Drive research and product definition of optical-electronic hybrid solutions, own the technology roadmap. System Architecture & Link Design : Lead link-system modeling, link budget analysis and simulation of Serdes; own ADC/DAC/PLL specification decomposition and mixed-signal architecture design. Chip & Module Delivery : Own requirement analysis, spec definition, design review, application-level testing, and production ramp of 800G/1.6T Driver/TIA and DSP electrical chips; be accountable for delivery quality and schedule. Standards & Ecosystem : Represent the company in standards bodies; contribute technical proposals from requirements, application, and link-design perspectives. Team & Technical Management : Build and lead cross-regional opto-electronic co-design teams; direct technology selection, risk identification/mitigation, and critical-problem resolution. Qualificatio

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