RF PCBA Design and Test Engineer

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Stack

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Descrizione

Worker Type Regular Job Description Summary We are seeking an RF PCBA Design and Test Engineer for the design, integration, and delivery of high-reliability RF/mixed-signal printed circuit assemblies for phased-array and advanced radar/communications products. You will own the PCB lifecycle—from stack-up definition and layout governance through fabrication, assembly, bring-up, release, and test lifecycle for production circuit card assemblies (CCAs) and integrated RF systems. Position Responsibilities Define multilayer, hybrid dielectric RF stack- including impedance tables, via strategy (blind/buried, backdrill, VIPPO), copper weights, and plating/finish (ENIG/ENEPIG) to meet RF loss, isolation, and manufacturability targets. Partition boards for RF, mixed-signal, and high-speed digital with attention to shielding, grounding, return paths, and thermal management (coins, thermal vias, heat spreaders). Establish and enforce RF layout rules (transitions, launch geometries, via fences, cavity cutouts, keep-outs) and high-speed constraints (length/phase matching, crosstalk control, reference continuity). Perform SI/PI/RF simulation and verification (e.g., ADS, HFSS, SIwave/Sigrity, CST) to predict insertion loss, VSWR/return loss, coupling, eye margins, and PDN impedance. Lead schematic capture, ECAD library governance (footprints/3D models), and DRC/DFM sign-off in Altium/Cadence/Mentor. Run formal design reviews, drive closure of action items, and maintain design histories, BOM

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