Senior Integrated Photonics Packaging Engineer (RF) (m/f/d)

Аналитика рынка

Стек

Бесплатно. Вход по почте.

Откликнуться

Загрузите резюме — мы свяжем вас с работодателем напрямую через нашу базу.

Описание

Your mission The future of AI computing is light, not electrons. At Q.ANT, we are building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor based architectures for next-generation AI and high-performance computing. As Senior Integrated Photonics Packaging Engineer (m/f/d) in our PIC OPS team, you will drive the transition of Q.ANT’s photonic computing technology from R&D prototypes to miniaturized, high-performance photonic modules. Focusing on RF and electro-optical packaging, you will define, develop, and verify high-frequency packaging concepts that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing design rules, you will create proprietary packaging architectures that form a core competitive differentiator for our technology. Your Impact & Responsibilities Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI) Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Bu

Полное описание, компания и ссылка на вакансию — после входа. Войти

Контакты работодателя (email/phone/telegram) скрыты из публичного превью — отправьте резюме, чтобы мы связали вас напрямую.