Principal Engineer, Package Design

Market insights

Stack

Free. Sign in with email.

Apply

Upload your CV — we will connect you with the employer directly through our pool.

Description

About SiTime SiTime is the Precision Timing company. Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT. Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: [link] Job Summary The Principal Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate custom-designed MEMS and CMOS components. We value diverse experiences, perspectives, and career paths, and welcome candidates who are excited to contribute to our mission. Responsibilities Develop new packaging technology for SiTime’s MEMS-based timing solutions Lead activities fo

Full description, company and the link to apply — after you sign in. Sign in

Employer contacts (email/phone/telegram) are hidden from the public preview — send your CV, and we will connect you directly.