Sr Manager, Packaging Assembly Operation

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Description

We are seeking an experienced Senior Manager of Semiconductor IC Packaging & Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output, customer commit dates, and revenue targets. The scope includes AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This role will lead assembly line readiness, manufacturing execution, capacity utilization, cycle time, yield performance, quality control, process change management, and ramp readiness while partnering closely with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and external OSAT partners.The ideal candidate combines deep semiconductor assembly operations expertise with strong hands-on manufacturing leadership, data-driven execution, and cross-functional collaboration skills to drive factory performance, product quality, delivery reliability, and continuous improvement across global operations. The Senior Manager also serves as a critical interface to Package Engineering and Supply Chain Management by ensuring

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