Electromechanical Packaging Engineer

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Description

Claros is a power management solutions company that is innovating at the intersection of power and compute to make AI more sustainable and widely available. By driving down the cost and complexity of power delivery and leveraging innovative hardware and software, the company seeks to decrease energy consumption, optimize power delivery, increase compute performance, and maximize the efficiency of AI operations. About The Team We are open-minded, fast paced, problem solvers that value open dialogue and candor. Our passion is to challenge the status-quo and we embrace transformational thinking. ”. We are mindful of our personal and organizational blinders and try to build an environment where our team members are At Their Best. What You Will Do The Electromechanical Packaging Engineer will be working with a Lead Engineer and be responsible for: Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line. Collaborate with substrate layout, ASIC design, and manufacturing engineers. Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test. What You Bring Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred. 5+ years’ experience with microelectronics packaging, and/or PCB design Knowledge of foundry processes and chip scale assembly processes</li&

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